BUILDING A BETTER FUTURE THROUGH CONVERGENCE
Soulbrain has grown through the stable supply of a variety of chemical materials needed in key processes of semiconductors, such as etchant and cleaning agents, CMP slurry, and precursors. Targeting the world’s best semiconductor companies, we provide ultra-high purity chemical materials, and we are expanding our global management with production bases in Korea and China. In addition, we are actively advancing the development of new materials which can respond to rapid changes in the semiconductor process, such as ultrafine process and transformation to 3D structure.
Since first domestication of TEOS, a chemical compound for the deposition of SiO₂ thin films, we have manufactured various ultra-high purity CVD/ALD precursors, such as high-k materials, and precursors for diffusion barriers. In addition, we are continuously developing and supporting new materials in response to the micronization of the semiconductor process, including new high-k materials, wiring materials, diffusion barrier materials, low-k materials, and gap-fill materials.
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In response to movement of the semiconductor process towards high integration and ultra-thin films, multi-functional cleaning and high-functional etching capabilities are in demand. As a leader, Soulbrain is supplying multi-functional etchants and cleaning agents in the areas of low-and-high E/R chemicals and high selectivity chemicals.
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HF (Hydrofluoric Acid)/BOE (Buffered Oxide Etchant), used in the etching and cleaning of semiconductor oxide films, are semiconductor grade ultra-high purity materials. Soulbrain is keeping pace with changes in the semiconductor process through continuous technological development while strengthening our market competitiveness based on the internalization of HF/BOE raw materials.
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Following the high integration of semiconductor products, slurries have been introduced as materials to achieve planarization of thin films, and are used in the planarization of insulating films and metal films used for the formation of highly integrated semiconductor wiring. We manufacture silica and ceria slurry products used in the CMP process, such as ILD/IMD, STI/SOD, W, and Cu, and we are continuously developing products with excellent planarization characteristics and low scratch occurrence, contributing to improved yield.
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Cu has lower resistivity and higher electron transport ability than aluminum, making it useful for application as a semiconductor wiring material; however, as it is difficult to deposit through CVD/ALD deposition, it is necessary to electroplate onto a wafer for formation of wiring. Soulbrain supplies the copper electroplating solution used in this process, and we are continuously developing high performance electroplating solutions and additives in demand for next generation semiconductor devices.
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Semiconductor